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According to reports, NVIDIA has contracted over 70% of TSMC's advanced packaging capacity this year
On February 24th, according to industry news, Nvidia's latest Blackwell architecture GPU chip has seen strong demand, accounting for more than 70% of TSMC's CoWoS-L advanced packaging capacity this year. Shipments have increased by more than 20% quarter-on-quarter.
2025-02-24 03:01:43
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